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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 16 tsz02201-0g3g0c200400-1-2 ? 2012 rohm co., ltd. all rights reserved. 10.dec.2015 rev.002 tsz22111 ? 14 ? 001 www.rohm.com 6-channel charge pump white led driver with 64 dimming steps and i 2 c compatible interface bd2606m vv general description bd2606mvv is a multi-level brightness control white led driver that not only ensures efficient boost by automatically changing the boost rate but also works as a constant current driver with 64 steps, so that the driving current can be adjusted finely. this ic is best suited to turn on white leds that require high-accuracy led brightness control. features 6- ch parallel led driver 64 -step led current adjust function inter-led relative current accuracy: 3% or less led individual lighting/dimming control via i 2 c bus interface automatic transition charge pump type dc/dc converter (x1, x1.5 and x 2) high efficiency (90% or more at maximum) various protection functions such as output voltage protection , over-current limiter and thermal shutdown circuit applications this driver is applicable for various fields such as mobile phones, portable game machines and white led products. key specifications power supply voltage range: 2.7v to 5.5v oscillation frequency: 1.0mhz(typ) quiescent current: 0 a( typ) operating temperature range: -30c to +85c package w(typ) x d(typ) x h(max) typical application circuit sqfn016v4040 4.00mm x 4.00mm x 1.00mm gnd leda1 leda2 ledb1 ledb2 en scl sda battery in out c1n c1p c2n c2p c 1 = 1 f c in = 1 f c out = 1 f ledc1 ledc2 c 2 = 1 f bd2606mvv datashee t datashee t downloaded from: http:///
2/ 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 absolute maximum ratings (ta=25 c ) parameter symbol ratings unit condition power supply voltage v max 7 v operating temperature range topr - 30 to +85 c storage temperature range tstg - 55 to +150 c power dissipation pd 0.78 (note 1) w (note 1) when mounted on a glass epoxy substrate (70mm x 70mm x 1. 6mm), derate by 6.2mw/ c for ta is higher than 25 c . caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is imp ortant to consider circuit protection measures such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=- 30 c to +85 c ) parameter symbol ratings unit condition operating power supply voltage v cc 2.7 to 5.5 v electrical characteristics (unless otherwise specified, ta = 25 c and v in = 3.6v.) parameter symbol limit unit conditions min typ m ax quiescent current i ddq - 0 7 a v en =0v, v in =3.6v circuit current 1 i dd1 - 1.0 2.6 ma x1 mode, i out =0ma, v in =3,6v [charge pump] output current i out - - 120 ma v out =4.0v, v in =3.6v oscillation frequency f osc 0.8 1.0 1.2 mhz add=0 x 03, d6= 0 [led driver] led current absolute precision i led-err - - 6.5 % i led =16.5ma(ledxcnt=0x20), led pin voltage 1.0v led current relative precision i led- to -led - 0.5 3.75 (note 2) % i led =16.5ma(ledxcnt=0x20) , led pin voltage 1.0v led control voltage v led - 0.2 0.25 v ileda1,ileda2,iledb1, iledb2,iledc1,iledc2 [logic interface] input l voltage v il - - 0.4 v en, scl, sda input h voltage v ih 1.6 - - v en, scl, sda input h current i ih - - 10 a en, scl, sda=v in input l current i il - 10 - - a en, scl, sda=gnd l level sda output v ol - - 0.4 v sda, 3ma source - - 0.6 v sda, 6ma source [i 2 c bus interface (standard mode)] scl clock frequency f sclc 0 - 100 khz scl low duration t low 4.7 - - s scl high duration t high 4.0 - - s data hold time t hd;dat 0 - 3.45 s data setup time t su;dat 250 - - ns setup time C restart condition t su;sta 4.7 - - s hold time C restart condition t hd;sta 4.0 - - s setup time C stop condition t su;sto 4.0 - - s bus free time between start and stop t buf 4.7 - - s [i 2 c bus interface (fast mode)] scl clock frequency f scl 0 - 400 khz scl low duration t low 1.3 - - s scl high duration t high 0.6 - - s data hold time t hd;dat 0 - 0.9 s data setup time t su;dat 100 - - ns setup time C restart condition t su;sta 0.6 - - s hold time C restart condition t hd;sta 0.6 - - s setup time C stop condition t su;sto 0.6 - - s bus free time between start and stop t buf 1.3 - - s interface startup time t en - - 350 s bus startup time (after en= h ) (note 2) the following expression is used for calculation: i led-match ={(i max -i min )/(i max +i min )} x 100 i max = current value in a channel with the maximum current value among all chann els i min =current value in a channel with the minimum current value among all cha nnels downloaded from: http:///
3/ 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 pin description pin number pin name in/out function pin number pin name in/out function 1 leda1 out led current driver output 9 c2n in/out flying capacitor pin negative (-) side 2 s da in i 2 c bus control pin 10 c2p in/out flying capacitor pin positive (+) side 3 scl in i 2 c bus control pin 11 gnd - gnd 4 en in on/off control 12 ledc2 out led current driver output 5 out out charge pump output 13 ledc1 out led current driver output 6 in - power supply 14 ledb2 out led current driver output 7 c1n in/out flying capacitor pin negative (-) side 15 ledb1 out led current driver output 8 c1p in/out flying capacitor pin positive (+) side 16 leda2 out led current driver output - thermal p ad - heat radiation pad of back side . connect to gnd - - - - block diagram pin number 16pin 1, 1.5, 2 charge pump over voltage protect osc tsd i 2 c i/f & control logic out control charge pump mode control gnd leda1 leda2 ledb1 ledb2 en scl sda in out c 1n c 1p c 2n c 2p ledc2 ledc2 current dac current dac current dac ledacnt ledbcnt ledccnt 6 6 6 downloaded from: http:///
4/ 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 typical performance curves ta=25c ta=- 30 c ta=85c figure 2. circuit current 1 vs input voltage (operation in x1.0 mode) input voltage: v in [v] circuit current 1 : i dd1 [m a] 40 50 60 70 80 90 100 2 3 4 5 6 7 input voltage: vin[v] efficiency [%] up down figure 3. efficiency hysteresis vs input voltage (13ma x 6 lights) input voltage: v in [v] efficiency [%] 0 10 20 30 40 50 60 70 80 90 100 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 input voltage: vin[v] efficiency [%] ta=85c ta=25c ta=- 30 c figure 4. efficiency vs input voltage (3.5ma x 6 lights) input voltage : v in [v] efficiency [%] 0.0 0.4 0.8 1.2 1.6 2.0 2 3 4 5 6 7 input voltage: vin[v] quiescent current: iq [a] ta=- 30 c ta=25c ta=85c figure 1. quiescent current vs input voltage (standby) input voltage: v in [v] quiescent current: i ddq [ a] downloaded from: http:///
5/ 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 typical performance curves - continued 0 10 20 30 40 50 60 70 80 90 100 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 input voltage: vin[v] efficiency [%] ta=25c ta=85c ta=- 30 c figure 6. efficiency vs input voltage (20ma x 6 lights) input voltage: v in [v] efficiency [%] -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0 10 20 30 40 50 60 state[dec] dnl [lsb] ta=85c ta=- 30 c ta=25c figure 8. led current characteristics (differential linearity error) dnl [ lsb] 0 10 20 30 40 50 60 70 80 90 100 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 input voltage: vin[v] efficiency [%] ta=25c ta=85c ta=- 30 c figure 5. efficiency vs input voltage (10ma x 6 lights) efficiency [%] input voltage: v in [v] 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 0.0 0.4 0.8 1.2 1.6 2.0 v led [v] led current [ma] ta=25c ta=- 30 c ta=85c figure 7. led current characteristics vs led control voltage (led current 16.5ma) led current [ma] led control voltage : v led [v] downloaded from: http:///
6/ 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 typical performance curves - continued -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0 10 20 30 40 50 60 state[dec] inl [lsb] ta=85c ta=- 30 c ta=25c figure 9. led current characteristics (integral linearity error) inl [lsb] 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 0 1 2 3 4 5 6 7 input voltage: vin[v] led current [ma] ta=25c ta=85c ta=- 30 c figure 11. led current vs input voltage (led current 16.5ma) input voltage: v in [v] led current [ma] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 10 20 30 40 50 60 state[dec] led current relative precision [%] ta=- 30 c ta=25c ta=85c figure 10. led current matching led current relative precision [%] downloaded from: http:///
7/ 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 sda en scl i 2 c interface buffer v en v en sda scl t su;dat t low s sr p s t buf t hd ;sta t su;sta t high t hd ;sta t f t hd;dat t su;sto t r application information 1. description of operations (1) led driver (a) i 2 c bus interface bd2606mvv can control the led on/off, brightness and charge pump sw itching frequency by writing to the register via the i 2 c bus interface. control by the i 2 c bus interface is effective when en is at h level. when en is at l level, this lsi is completely shut down and the control and associate d functions via the i 2 c bus interface are all stopped. as shown in figure 12 below, the i 2 c bus interface of bd2606mvv operates using the v en voltage (buffering the en pin voltage) as supply voltage. for this reason, it is desirable that the h voltage in the i 2 c bus interface is equal to the en pin voltage. figure 12. i 2 c bus interface buffer figure 13. i 2 c bus interface timing bd2606mvv operates as a slave device for the i 2 c bus interface. ? slave address a7 a6 a5 a4 a3 a2 a1 r/w 1 1 0 0 1 1 0 1/0 ? data format the data format is shown below. write format: s w as as sr r as as p one-byte register data 7 bit 8 bit 7 bit 8 bit slave address one-byte register address slave address or s w as as as p one-byte register address one-byte register data 7 bit slave address 8 bit 8 bit read format: s w as as sr r as am p one-byte register address slave address one-byte register data slave address 8 bit 7 bit 7 bit 8 bit (note ) s: start condition w: 0=write r: 1=read as: acknowledge (slave -> master) am: no acknowledge s r : repeated start condition p: stop condition downloaded from: http:///
8/ 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 (b) register table ? register map address hex register name d7 d6 d5 d4 d3 d2 d1 d0 function 0x00 le dacnt - - ledacnt current setting of ileda1/2 0x01 ledbcnt - - ledbcnt current setting of iledb1/2 0x02 ledccnt - - ledccnt current setting of iledc1/2 0x03 ledpwr cnt - freqnt 1/0 ledc2 ledc1 ledb2 ledb1 leda2 leda1 current driver on/off control (note) - : invalid at write time - : l at read time ? description of registers ledacnt (initial value: undefined) --- ledbcnt (initial value: undefined) --- ledccnt (initial value: undefined ) --- led current values are controlled. leda1/a2, ledb1/b2 and ledc1/c2 are con trolled through the registers ledacnt, ledbcnt and ledccnt respectively, and the current setting can be sw itched every 2 channels. for the current setting value in each register setting, refer to led current setting table on page 9. leda1 (initial value: 0) --- leda2 (initial value: 0) --- ledb1 (initial value: 0) --- ledb2 (initial value: 0) --- ledc1 (initial value: 0) --- ledc2 (initial value: 0) --- the on/off setting of each led driver channel is as follows: 0 : off 1 :on freqcnt (initial value: 0) --- the switching frequency of a charge pump is set as follows: 0 : 1mhz 1: 250khz when 250khz is selected, the flying capacitor of c 1 , c 2 and c out must be set to 10 f. downloaded from: http:///
9/ 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 ? led current setting table the following table lists the current setting values for the res pective register settings. initially, these registers have not been initialized. for this reaso n, they are not initialized under en= 0. d5 d4 d3 d2 d1 d0 output current (ma) d5 d4 d3 d2 d1 d0 output current (ma) 0 0 0 0 0 0 0.5 1 0 0 0 0 0 16.5 0 0 0 0 0 1 1.0 1 0 0 0 0 1 17.0 0 0 0 0 1 0 1.5 1 0 0 0 1 0 17.5 0 0 0 0 1 1 2.0 1 0 0 0 1 1 18.0 0 0 0 1 0 0 2.5 1 0 0 1 0 0 18.5 0 0 0 1 0 1 3.0 1 0 0 1 0 1 19.0 0 0 0 1 1 0 3.5 1 0 0 1 1 0 19.5 0 0 0 1 1 1 4.0 1 0 0 1 1 1 20.0 0 0 1 0 0 0 4.5 1 0 1 0 0 0 20.5 0 0 1 0 0 1 5.0 1 0 1 0 0 1 21.0 0 0 1 0 1 0 5.5 1 0 1 0 1 0 21.5 0 0 1 0 1 1 6.0 1 0 1 0 1 1 22.0 0 0 1 1 0 0 6.5 1 0 1 1 0 0 22.5 0 0 1 1 0 1 7.0 1 0 1 1 0 1 23.0 0 0 1 1 1 0 7.5 1 0 1 1 1 0 23.5 0 0 1 1 1 1 8.0 1 0 1 1 1 1 24.0 0 1 0 0 0 0 8.5 1 1 0 0 0 0 24.5 0 1 0 0 0 1 9.0 1 1 0 0 0 1 25.0 0 1 0 0 1 0 9.5 1 1 0 0 1 0 25.5 0 1 0 0 1 1 10.0 1 1 0 0 1 1 26.0 0 1 0 1 0 0 10.5 1 1 0 1 0 0 26.5 0 1 0 1 0 1 11.0 1 1 0 1 0 1 27.0 0 1 0 1 1 0 11.5 1 1 0 1 1 0 27.5 0 1 0 1 1 1 12.0 1 1 0 1 1 1 28.0 0 1 1 0 0 0 12.5 1 1 1 0 0 0 28.5 0 1 1 0 0 1 13.0 1 1 1 0 0 1 29.0 0 1 1 0 1 0 13.5 1 1 1 0 1 0 29.5 0 1 1 0 1 1 14.0 1 1 1 0 1 1 30.0 0 1 1 1 0 0 14.5 1 1 1 1 0 0 30.5 0 1 1 1 0 1 15.0 1 1 1 1 0 1 31.0 0 1 1 1 1 0 15.5 1 1 1 1 1 0 31.5 0 1 1 1 1 1 16.0 1 1 1 1 1 1 32.0 downloaded from: http:///
10 / 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 (2) charge pump (a) description of operations pin voltage comparison takes place at out control section, and t hen v out generation takes place so that the led cathode voltage with the highest v f is set to 0.1v. a boost rate is changed automatically to a proper one at the charge pump mode control section so that operation can take place at p ossible low boost rate. when the current taken from the in pin exceeds 600ma, the overcurrent limiter is activated an d the ic resets. in addition, if the output voltage falls below 1.5v, the ic will reset due to short- circuit at the output. (b) soft-start function bd2606mvv has a soft start function that prevents rush current. soft start ordinal mode en/led* v out i led t off figure 14. soft-start (c) automatic boost rate change the boost rate automatically switches to the best mode. ? (x1 mode x1.5 mode) or (x1.5 mode x2 mode) if a battery voltage drop occurs, bd2606mvv cannot maintain the led constant current and then mode transition begins. ? (x1.5 mode x1 mode) or (x2 mode x1.5 mode) if a battery voltage rise occurs, the output voltage (v out ) and the supply voltage (v in ) detection are activated and then mode transition begins. (3) uvlo (ultra low voltage lock out) if the input voltage falls below 2.2v, bd2606mvv is shut down to preven t malfunction due to ultra-low voltage. (4) ovp (over voltage protection) this circuit protects the ic against damage when th e c/p output voltage (v out ) rises extremely for some external factors. (5) thermal shutdown (tsd) to protect the ic against thermal damage or heat-driven unco ntrolled operations, this circuit turns off the output if the chip temperature rises over 150 c . downloaded from: http:///
11 / 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 2. recommended pcb layout in pcb design, wire the power supply line in a way that the pcb impedance goes low and provide a bypas s capacitor if needed. heat radiation of back side pad is used for improv ing the efficiency of ic heat radiation. solder pad to gnd pin. moreover, connect ground plane of board using via a s shown in the patterns of below page. the efficiency of heat radiation improves according to the area of ground plane. en out in scl to substrate gnd gnd sda to substrate vcc c out c in c 1 c 2 c in c 1 c 2 vcc c out out sda scl rear-side gnd en figure 15. application layout image (top view) figure 16. front (top view) 3. application parts selection method capacitor (use a ceramic capacitor with good frequency and temperatu re characteristics) symbol recommended value recommended parts type c out ,c in ,c 1 ,c 2 1 f grm188b11a105ka61b(murata) ceramic capacitor connect an input bypass capacitor c in between in and gnd pin and an output capacitor between out and gnd pin in proximity. place both c1p-c1n and c2p-c2n capacitors in proximity to th e chip. furthermore, select a ceramic capacitor with a sufficient rating for the voltage to be applied . when other than these parts are used, the equivalent parts must be used. downloaded from: http:///
12 / 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions ag ainst reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trace s, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
13 / 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 17. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. tsd on temp. [ c ] (typ) bd 2606mvv 175 n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
14 / 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 ordering information b d 2 6 0 6 m v v - e 2 part number package mvv:sqfn016v4040 packaging and forming specification e2: embossed tape and reel marking diagram sqfn0 16 v4040 (top view) d 2 6 0 6 part number marking lot number 1pin mark downloaded from: http:///
15 / 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 physical dimension, tape and reel information package name sqfn016v4040 downloaded from: http:///
16 / 16 bd2606mvv ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.dec.2015 rev.002 tsz02201-0g3g0c200400-1-2 revision history date revision changes 03.dec.2012 001 new release 10.dec.2015 00 2 applied the rohm standard style and improved understandabili ty. downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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